Invention Grant
- Patent Title: Electronic circuit device and method for manufacturing same
- Patent Title (中): 电子电路装置及其制造方法
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Application No.: US11909886Application Date: 2006-04-14
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Publication No.: US07935892B2Publication Date: 2011-05-03
- Inventor: Kazuhiro Nishikawa , Hidenori Miyakawa , Norihito Tsukahara , Shigeaki Sakatani
- Applicant: Kazuhiro Nishikawa , Hidenori Miyakawa , Norihito Tsukahara , Shigeaki Sakatani
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2005-116833 20050414
- International Application: PCT/JP2006/307915 WO 20060414
- International Announcement: WO2006/112383 WO 20061026
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.
Public/Granted literature
- US20090133900A1 ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2009-05-28
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