Invention Grant
- Patent Title: Circuit device and method of manufacturing the same
- Patent Title (中): 电路装置及其制造方法
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Application No.: US12064996Application Date: 2006-08-30
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Publication No.: US07935899B2Publication Date: 2011-05-03
- Inventor: Sadamichi Takukusaki , Noriaki Sakamoto
- Applicant: Sadamichi Takukusaki , Noriaki Sakamoto
- Applicant Address: JP Moriguchi
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Moriguchi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-252187 20050831
- International Application: PCT/JP2006/317605 WO 20060830
- International Announcement: WO2007/026945 WO 20070308
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.
Public/Granted literature
- US20090135572A1 Circuit Device and Method of Manufacturing the Same Public/Granted day:2009-05-28
Information query
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