Invention Grant
- Patent Title: Keypad assembly
- Patent Title (中): 键盘装配
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Application No.: US11869543Application Date: 2007-10-09
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Publication No.: US07935904B2Publication Date: 2011-05-03
- Inventor: Sung-Hoon Song
- Applicant: Sung-Hoon Song
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2006-0101639 20061019
- Main IPC: H01H13/70
- IPC: H01H13/70

Abstract:
Provided is a keypad assembly used as a data input unit in various electronic devices. The keypad assembly includes a main board having one or more metal domes formed at predetermined positions on the main board, and a keypad disposed on the main board to apply a pressure on the metal dome and to be used as a touchpad according to a mode selection, the keypad includes a keytop layer having one or more keytops on which corresponding alphanumeric characters are formed, a touchpad layer disposed under the keytop layer; and a base layer disposed under the touchpad layer, and having one or more protrusions protruding from its bottom surface at the positions corresponding to the metal dome.
Public/Granted literature
- US20080094373A1 KEYPAD ASSEMBLY Public/Granted day:2008-04-24
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