Invention Grant
US07935941B2 Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
有权
使用在非相邻结构上在轴上间隔开的多个激光束点的半导体结构处理
- Patent Title: Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
- Patent Title (中): 使用在非相邻结构上在轴上间隔开的多个激光束点的半导体结构处理
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Application No.: US11051263Application Date: 2005-02-04
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Publication No.: US07935941B2Publication Date: 2011-05-03
- Inventor: Kelly J. Bruland , Brian W. Baird , Ho Wai Lo , Frank G. Evans
- Applicant: Kelly J. Bruland , Brian W. Baird , Ho Wai Lo , Frank G. Evans
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Stoel Rives LLP
- Main IPC: B23K26/08
- IPC: B23K26/08 ; B23K26/38

Abstract:
Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.
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