Invention Grant
US07935966B2 Semiconductor device with heterojunctions and an inter-finger structure
有权
具有异质结和手指间结构的半导体器件
- Patent Title: Semiconductor device with heterojunctions and an inter-finger structure
- Patent Title (中): 具有异质结和手指间结构的半导体器件
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Application No.: US11813676Application Date: 2006-01-18
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Publication No.: US07935966B2Publication Date: 2011-05-03
- Inventor: Pierre Jean Ribeyron , Claude Jaussaud , Pere Roca I. Cabarrocas , Jerome Damon-Lacoste
- Applicant: Pierre Jean Ribeyron , Claude Jaussaud , Pere Roca I. Cabarrocas , Jerome Damon-Lacoste
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique Et Aux Energies Alternatives
- Current Assignee: Commissariat a l'Energie Atomique Et Aux Energies Alternatives
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0550174 20050120
- International Application: PCT/FR2006/050021 WO 20060118
- International Announcement: WO2006/077343 WO 20060727
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/0376 ; H01L31/20 ; H01L31/036

Abstract:
A semiconductor device including, on at least one surface of a crystalline semiconductor substrate, at least one first amorphous semiconductor region doped with a first type of conductivity. The semiconductor substrate includes, on the same at least one surface, at least one second amorphous semiconductor region doped with a second type of conductivity, opposite the first type of conductivity. The first amorphous semiconductor region, insulated for the second amorphous semiconductor region by at least ore dielectric region in the contact with the semiconductor substrate, and the second amorphous semiconductor region form an interdigitated structure.
Public/Granted literature
- US20080061293A1 Semiconductor Device with Heterojunctions and an Inter-Finger Structure Public/Granted day:2008-03-13
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