Invention Grant
- Patent Title: Light emitting diode module
- Patent Title (中): 发光二极管模块
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Application No.: US12330968Application Date: 2008-12-09
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Publication No.: US07935971B2Publication Date: 2011-05-03
- Inventor: Min Sang Lee , Tae Hong Lee , Won Hoe Koo , Kyung Seob Oh
- Applicant: Min Sang Lee , Tae Hong Lee , Won Hoe Koo , Kyung Seob Oh
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Led Co. Ltd.
- Current Assignee: Samsung Led Co. Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0081212 20080820
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
The present invention relates to a light emitting diode module capable of facilitating the connection between light emitting diode modules.The present invention provides a light emitting diode module including an insulating layer, a first circuit pattern layer and a second circuit pattern layer which are stacked on a top surface and a bottom surface of the insulating layer respectively and have one ends protruding to an outside of the insulating layer and the other ends positioned inside the insulating layer, a solder resist layer coated on the first circuit pattern layer, a first via formed vertically through a portion of the solder resist layer to be electrically connected to the first circuit pattern layer, a second via formed vertically through a portion of the solder resist layer and the insulating layer to be electrically connected to the second circuit pattern layer and a light emitting element mounted on the solder resist layer.
Public/Granted literature
- US20100044742A1 LIGHT EMITTING DIODE MODULE Public/Granted day:2010-02-25
Information query
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