Invention Grant
- Patent Title: Package of light emitting diode and method for manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US12162105Application Date: 2007-01-23
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Publication No.: US07935976B2Publication Date: 2011-05-03
- Inventor: Bo Geun Park
- Applicant: Bo Geun Park
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch Stewart Kolasch & Birch, LLP
- Priority: KR10-2006-0008158 20060126
- International Application: PCT/KR2007/000381 WO 20070123
- International Announcement: WO2007/086668 WO 20070802
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
Provided is a package of a light emitting diode. The package includes a metal plate, a light-emitting diode chip, an insulating layer, a lead frame, a reflective coating layer, and a molding material. The light-emitting diode chip is surface-mounted on the metal plate, and the insulating layer is formed on the metal plate and is separated from the light-emitting diode chip. The lead frame is provided on the insulating layer, the reflective coating layer is formed on the lead frame, and the molding material molds the light-emitting diode chip in a predetermined shape.
Public/Granted literature
- US20090020774A1 PACKAGE OF LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-01-22
Information query
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