Invention Grant
- Patent Title: Wire bonding to connect electrodes
- Patent Title (中): 引线键合连接电极
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Application No.: US12234601Application Date: 2008-09-19
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Publication No.: US07935979B2Publication Date: 2011-05-03
- Inventor: Frank Shum , William So
- Applicant: Frank Shum , William So
- Applicant Address: US CA Livermore
- Assignee: Bridgelux, Inc.
- Current Assignee: Bridgelux, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Arent Fox LLP
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting apparatus includes a semiconductor layer having an electrode with two traces physically separated from one another. The light emitting apparatus further includes a wire bond electrically connecting the two traces.
Public/Granted literature
- US20090273001A1 WIRE BONDING TO CONNECT ELECTRODES Public/Granted day:2009-11-05
Information query
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