Invention Grant
- Patent Title: Semiconductor device with backfilled isolation
- Patent Title (中): 具有回填隔离的半导体器件
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Application No.: US11244566Application Date: 2005-10-06
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Publication No.: US07936006B1Publication Date: 2011-05-03
- Inventor: Yuhao Luo , Deepak Kumar Nayak , Daniel Gitlin
- Applicant: Yuhao Luo , Deepak Kumar Nayak , Daniel Gitlin
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Scott Hewett; Thomas George
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An MOS device has an embedded dielectric structure underlying an active portion of the device, such as a source extension or a drain extension. In an alternative embodiment, an embedded dielectric structure underlies the channel region of a MOS device, as well as the source and drain extensions.
Information query
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