Invention Grant
- Patent Title: Film type package for fingerprint sensor
- Patent Title (中): 指纹传感器胶片式包装
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Application No.: US11727200Application Date: 2007-03-23
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Publication No.: US07936032B2Publication Date: 2011-05-03
- Inventor: Ming-Liang Huang , Yao-Jung Lee , Ming-Hsun Li
- Applicant: Ming-Liang Huang , Yao-Jung Lee , Ming-Hsun Li
- Applicant Address: TW Hsinchu BM Hamilton
- Assignee: ChipMOS Technologies Inc.,ChipMOS Technologies (Bermuda) Ltd.
- Current Assignee: ChipMOS Technologies Inc.,ChipMOS Technologies (Bermuda) Ltd.
- Current Assignee Address: TW Hsinchu BM Hamilton
- Agency: WPAT, P.C.
- Agent Anthony King
- Priority: TW95137189A 20061005
- Main IPC: H01L31/107
- IPC: H01L31/107

Abstract:
A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film with a plurality of leads and at least an encapsulant to encapsulate the bumps. A sensing area is formed on an active surface of the fingerprint sensor chip. The bumps are disposed on the active surface and located at two opposing sides of the sensing area. The wiring film has an opening to expose the sensing area. Each lead has an inner end and an outer end. The inner ends are located at two opposing sides of the opening and are bonded to the bumps. Preferably, the wiring film has a flexible extension and the outer ends of the leads are rerouted to the extension for external electrical connections.
Public/Granted literature
- US20080085038A1 Flim type package for fingerprint sensor Public/Granted day:2008-04-10
Information query
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