Invention Grant
- Patent Title: Micro-optical device packaging system
- Patent Title (中): 微光器件封装系统
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Application No.: US12345421Application Date: 2008-12-29
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Publication No.: US07936033B2Publication Date: 2011-05-03
- Inventor: Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
- Applicant: Bradley Morgan Haskett , John Patrick O'Connor , Mark Myron Miller , Sean Timothy Crowley , Jeffery Alan Miks , Mark Phillip Popovich
- Applicant Address: US TX Dallas US AZ Chandler
- Assignee: Texas Instruments Incorporated,Amkor Technology, Inc.
- Current Assignee: Texas Instruments Incorporated,Amkor Technology, Inc.
- Current Assignee Address: US TX Dallas US AZ Chandler
- Agent Charles A. Brill; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L31/0203
- IPC: H01L31/0203

Abstract:
According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.
Public/Granted literature
- US20100164081A1 Micro-Optical Device Packaging System Public/Granted day:2010-07-01
Information query
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