Invention Grant
US07936036B2 Solid-state image sensor with two different trench isolation implants
有权
具有两个不同沟槽隔离植入物的固态图像传感器
- Patent Title: Solid-state image sensor with two different trench isolation implants
- Patent Title (中): 具有两个不同沟槽隔离植入物的固态图像传感器
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Application No.: US12434474Application Date: 2009-05-01
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Publication No.: US07936036B2Publication Date: 2011-05-03
- Inventor: Shouzi Tanaka , Ryohei Miyagawa
- Applicant: Shouzi Tanaka , Ryohei Miyagawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-125087 20080512
- Main IPC: H01L31/112
- IPC: H01L31/112

Abstract:
A solid-state image sensor includes: a trench isolation region; a photodiode region for converting incident light to signal charges and accumulating the signal charges therein; a floating diffusion region for accumulating the signal charges of the photodiode region; a gate electrode formed over the element formation region located between the photodiode region and the floating diffusion region, and formed so that both ends of the gate electrode respectively overlap a part of the photodiode region and a part of the floating diffusion region; and an inactive layer formed in a region located in a bottom portion and sidewall portions of the trench isolation region. An impurity concentration in a region located under the gate electrode in the inactive layer is lower than that in a region other than the region located under the gate electrode in the inactive layer.
Public/Granted literature
- US20090278181A1 SOLID-STATE IMAGE SENSOR AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-11-12
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