Invention Grant
- Patent Title: Integrated passive device substrates
- Patent Title (中): 集成无源器件衬底
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Application No.: US11378106Application Date: 2006-03-17
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Publication No.: US07936043B2Publication Date: 2011-05-03
- Inventor: Yinon Degani , Yu Fan , Charley Chunlei Gao , Maureen Lau , Kunquan Sun , Liguo Sun
- Applicant: Yinon Degani , Yu Fan , Charley Chunlei Gao , Maureen Lau , Kunquan Sun , Liguo Sun
- Applicant Address: US TX Plano
- Assignee: Sychip Inc.
- Current Assignee: Sychip Inc.
- Current Assignee Address: US TX Plano
- Agent Peter V.D. Wilde
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
The specification describes an integrated passive device (IPD) that is formed on a silicon substrate covered with an oxide layer. Unwanted accumulated charge at the silicon/oxide interface are rendered immobile by creating trapping centers in the silicon surface. The trapping centers are produced by a polysilicon layer interposed between the silicon substrate and the oxide layer.
Public/Granted literature
- US20070215976A1 Integrated passive device substrates Public/Granted day:2007-09-20
Information query
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