Invention Grant
US07936053B2 Integrated circuit package system with lead structures including a dummy tie bar
有权
具有引线结构的集成电路封装系统，包括虚拟连接条
- Patent Title: Integrated circuit package system with lead structures including a dummy tie bar
- Patent Title (中): 具有引线结构的集成电路封装系统，包括虚拟连接条
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Application No.: US11558387Application Date: 2006-11-09
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Publication No.: US07936053B2Publication Date: 2011-05-03
- Inventor: Jeffrey D. Punzalan , Henry D. Bathan , Il Kwon Shim , Zigmund Ramirez Camacho
- Applicant: Jeffrey D. Punzalan , Henry D. Bathan , Il Kwon Shim , Zigmund Ramirez Camacho
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures.
Public/Granted literature
- US20070114645A1 INTEGRATED CIRCUIT PACKAGE SYSTEM CONFIGURED FOR SINGULATION Public/Granted day:2007-05-24
Information query
IPC分类:
