Invention Grant
- Patent Title: Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
- Patent Title (中): 提供邻近电子设备的接触结构的导电壁结构
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Application No.: US12044893Application Date: 2008-03-07
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Publication No.: US07936177B2Publication Date: 2011-05-03
- Inventor: Keith J. Breinlinger , David P. Pritzkau , Benjamin N. Eldridge
- Applicant: Keith J. Breinlinger , David P. Pritzkau , Benjamin N. Eldridge
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Kirton & McConkie
- Main IPC: G01R31/20
- IPC: G01R31/20

Abstract:
Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient contact structures, which can extend from the substrate. A first of the contact structures can be part of an electrical path through the electronic apparatus. A first electrically conductive wall structure can also extend from the substrate, and the first wall structure can be disposed adjacent one of the contact structures. The first wall structure can be electrically connected to a return current path within the electronic apparatus for an alternating current signal or power on the first contact structure.
Public/Granted literature
- US20090224785A1 PROVIDING AN ELECTRICALLY CONDUCTIVE WALL STRUCTURE ADJACENT A CONTACT STRUCTURE OF AN ELECTRONIC DEVICE Public/Granted day:2009-09-10
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