Invention Grant
- Patent Title: Test probe
- Patent Title (中): 测试探头
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Application No.: US12545869Application Date: 2009-08-24
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Publication No.: US07936178B2Publication Date: 2011-05-03
- Inventor: Wei-Fan Ting
- Applicant: Wei-Fan Ting
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Priority: TW98123974A 20090715
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/067
Abstract:
A test probe is provided. The test probe includes a group of shielding boards and two probe pins. The group of shielding boards has two opposite surfaces. The group of shielding boards includes at least two insulation boards and at least one metal board. The metal board is formed between the two insulation boards. The two probe pins are formed on the two surfaces of the group of shielding boards and have a distance between each other.
Public/Granted literature
- US20110012634A1 Test probe Public/Granted day:2011-01-20
Information query
