Invention Grant
- Patent Title: Adjustable resistor embedded in multi-layered substrate and method for forming the same
- Patent Title (中): 嵌入多层基板的可调电阻及其形成方法
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Application No.: US11488608Application Date: 2006-07-19
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Publication No.: US07936243B2Publication Date: 2011-05-03
- Inventor: Ying-Jiunn Lai , Chang-Sheng Chen , Chin-Sun Shyu , Uei-Ming Jow , Chang-Lin Wei
- Applicant: Ying-Jiunn Lai , Chang-Sheng Chen , Chin-Sun Shyu , Uei-Ming Jow , Chang-Lin Wei
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW95110179A 20060324
- Main IPC: H01F27/28
- IPC: H01F27/28

Abstract:
An adjustable resistor embedded in a multi-layered substrate and method for forming the same. The adjustable resistor comprises: a planar resistor, having a plurality of terminals; and a plurality of connecting lines connected to the planar resistor, each of the connecting lines being drawn from each of the terminals of the planar resistor so as to form a resistor network, wherein the connecting lines are selectively broken by a process for drilling the substrate to form a number of combinations of opened connecting lines such that the resistance value of the adjustable resistor is varied and thus the resistance value of the adjustable resistor can be precisely adjusted.
Public/Granted literature
- US20070222552A1 Adjustable resistor embedded in multi-layered substrate and method for forming the same Public/Granted day:2007-09-27
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