A resistor arrangement with resistor elements is specified that are arranged essentially regularly and that are spaced apart from each other and that are interconnected by a flexible substrate. According to a first preferred embodiment, intermediate spaces that are provided to carry a flow of flowing medium are arranged between the resistor elements. According to a second preferred embodiment, the resistor elements are arranged between two flexible substrates and are rigidly connected to these substrates. According to a third preferred embodiment, an electrically insulating adhesive layer that has openings through which the resistor elements are conductively connected to the substrate is arranged between the resistor elements and the substrate. According to a fourth preferred embodiment, the substrate is composed of, as a ground material, an elastic plastic that is filled with electrically conductive particles. In addition, a method for producing the resistor arrangement is specified.