Invention Grant
- Patent Title: Cooling device and electronic equipment including cooling device
- Patent Title (中): 冷却装置和电子设备包括冷却装置
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Application No.: US12544166Application Date: 2009-08-19
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Publication No.: US07936560B2Publication Date: 2011-05-03
- Inventor: Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
- Applicant: Hiroyuki Toyoda , Akio Idei , Shigeyasu Tsubaki , Tadakatsu Nakajima , Yoshihiro Kondo , Tomoo Hayashi
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-244279 20080924
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.
Public/Granted literature
- US20100073866A1 COOLING DEVICE AND ELECTRONIC EQUIPMENT INCLUDING COOLING DEVICE Public/Granted day:2010-03-25
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