Invention Grant
- Patent Title: Electronic apparatus and flexible printed wiring board
- Patent Title (中): 电子设备和柔性印刷线路板
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Application No.: US12615064Application Date: 2009-11-09
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Publication No.: US07936565B2Publication Date: 2011-05-03
- Inventor: Kiyomi Muro , Sadahiro Tamai
- Applicant: Kiyomi Muro , Sadahiro Tamai
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2009-053721 20090306
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.
Public/Granted literature
- US20100226103A1 ELECTRONIC APPARATUS AND FLEXIBLE PRINTED WIRING BOARD Public/Granted day:2010-09-09
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