Invention Grant
- Patent Title: Defective bit scheme for multi-layer integrated memory device
- Patent Title (中): 多层集成存储器件的不良位方案
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Application No.: US12502194Application Date: 2009-07-13
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Publication No.: US07936622B2Publication Date: 2011-05-03
- Inventor: Hai Li , Yiran Chen , Dadi Setiadi , Harry Hongyue Liu , Brian Lee
- Applicant: Hai Li , Yiran Chen , Dadi Setiadi , Harry Hongyue Liu , Brian Lee
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Fellers, Snider et al.
- Main IPC: G11C29/00
- IPC: G11C29/00

Abstract:
Various embodiments of the present invention are generally directed to an apparatus and associated method for handling defective bits in a multi-layer integrated memory device. In accordance with some embodiments, the multi-layer integrated memory device is formed from a plurality of vertically stacked semiconductor layers each having a number of storage sub-arrays and redundant sub-arrays. Each semiconductor layer is tested to determine a defect rate for each array, and a defective portion of a first semiconductor layer having a relatively higher defect rate is stored to a redundant sub-array of a second semiconductor layer having a relatively lower defect rate.
Public/Granted literature
- US20110007588A1 Defective Bit Scheme for Multi-Layer Integrated Memory Device Public/Granted day:2011-01-13
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