Invention Grant
- Patent Title: Molded-component stress-strain curve estimation device
- Patent Title (中): 模压部件应力 - 应变曲线估计装置
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Application No.: US11747457Application Date: 2007-05-11
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Publication No.: US07937183B2Publication Date: 2011-05-03
- Inventor: Hiroki Yamasaki , Yuan Zhong , Noritaka Takagi
- Applicant: Hiroki Yamasaki , Yuan Zhong , Noritaka Takagi
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-141131 20060522
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A molded-component characteristic estimation device that estimates the stress-strain curve of each portion of a molded-component includes a storage unit that stores correlation data showing the correlation between solidification time and mechanical characteristics of a material for the molded-component; and a controller that estimates solidification time of each portion of the molded-component using a shape model of the molded-component, calculates a mechanical characteristic value of each portion based on the correlation data and the estimated solidification time, and estimates the stress-strain curve of each portion of the molded-component based on the calculated mechanical characteristic value. With this device, the stress-strain curve of each portion of the molded-component is estimated without actual measurement.
Public/Granted literature
- US20070270989A1 MOLDED-COMPONENT CHARACTERISTIC ESTIMATION DEVICE Public/Granted day:2007-11-22
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