Invention Grant
- Patent Title: Chip overheating protection
- Patent Title (中): 芯片过热保护
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Application No.: US11805581Application Date: 2007-05-23
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Publication No.: US07937188B2Publication Date: 2011-05-03
- Inventor: Michael Yu Liu , Bradley Eugene Roach , Vuong Cao Nguyen , Peter Mark Fiacco , Shak Loong Kwok
- Applicant: Michael Yu Liu , Bradley Eugene Roach , Vuong Cao Nguyen , Peter Mark Fiacco , Shak Loong Kwok
- Applicant Address: US CA Costa Mesa
- Assignee: Emulex Design & Manufacturing Corporation
- Current Assignee: Emulex Design & Manufacturing Corporation
- Current Assignee Address: US CA Costa Mesa
- Agency: Morrison & Foerster LLP
- Main IPC: G06F15/00
- IPC: G06F15/00

Abstract:
Embodiments of the present invention are directed to systems and methods for controlling the temperature of an internal device while reducing or minimizing the involvement of the host. Thus, some of the heat monitoring and remediation work may be offloaded to the actual device itself. The device may monitor its own temperature and, in the event of high temperature, perform device specific heat reduction actions without involving the host. Furthermore, the device may, upon detecting temperature within a predefined range, alert the host of a high temperature condition in order to allow the host to perform temperature reduction measures. Also, the device may, upon detecting temperature within a predefined range, alert the host of an impending device shutdown and shut the device down. In addition, the device may periodically save its temperature into non-volatile memory in order to create a temperature log.
Public/Granted literature
- US20080294296A1 Chip overheat protection Public/Granted day:2008-11-27
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