Invention Grant
- Patent Title: Method and system for flexible and negotiable exchange of link layer functional parameters
- Patent Title (中): 链路层功能参数的灵活和协商交换的方法和系统
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Application No.: US12242271Application Date: 2008-09-30
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Publication No.: US07937505B2Publication Date: 2011-05-03
- Inventor: Phanindra K. Mannava , Victor W. Lee , Aaron T. Spink
- Applicant: Phanindra K. Mannava , Victor W. Lee , Aaron T. Spink
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F3/00
- IPC: G06F3/00
Abstract:
A proposal is discussed that facilitates exchanging parameters for a link layer that allows a variable number of parameters without changing a communication protocol. Likewise, the proposal allows for both components connected via the link to negotiate values for the parameters that are exchanged without a need for external agent intervention or redundancy.
Public/Granted literature
- US20090063813A1 METHOD AND SYSTEM FOR FLEXIBLE AND NEGOTIABLE EXCHANGE OF LINK LAYER FUNCTIONAL PARAMETERS Public/Granted day:2009-03-05
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