Invention Grant
US07937631B2 Method for self-test and self-repair in a multi-chip package environment
有权
在多芯片封装环境中进行自检和自我修复的方法
- Patent Title: Method for self-test and self-repair in a multi-chip package environment
- Patent Title (中): 在多芯片封装环境中进行自检和自我修复的方法
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Application No.: US11846482Application Date: 2007-08-28
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Publication No.: US07937631B2Publication Date: 2011-05-03
- Inventor: Thomas Vogelsang
- Applicant: Thomas Vogelsang
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Patterson & Sheridan, LLP
- Main IPC: G11C29/00
- IPC: G11C29/00
Abstract:
A method and apparatus for operating a component including a memory device. The method includes receiving a plurality of commands and determining if a set of the plurality of commands matches a predefined pattern of commands configured to place the memory device into a test mode. Upon determining that the set of the plurality of commands matches the predefined plurality of commands, the memory device is placed in the test mode.
Public/Granted literature
- US20090063916A1 METHOD FOR SELF-TEST AND SELF-REPAIR IN A MULTI-CHIP PACKAGE ENVIRONMENT Public/Granted day:2009-03-05
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