Invention Grant
US07937636B2 Semiconductor device and inspection method of semiconductor device and wireless chip
有权
半导体器件和无线芯片的半导体器件和检测方法
- Patent Title: Semiconductor device and inspection method of semiconductor device and wireless chip
- Patent Title (中): 半导体器件和无线芯片的半导体器件和检测方法
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Application No.: US12692785Application Date: 2010-01-25
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Publication No.: US07937636B2Publication Date: 2011-05-03
- Inventor: Hiroki Dembo
- Applicant: Hiroki Dembo
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2005-228639 20050805
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
The invention provides an inspection method of a semiconductor device which receives a test program wirelessly. As an inspection method of the semiconductor device, a test program is transmitted as a communication signal for every test. By transmitting a test program as a communication signal wirelessly in the case of an operation test, test contents are changed as required. As a result, a test program can be easily changed and an inspection circuit or the like is not required. In this manner, manufacturing cost of a wireless chip can be reduced.
Public/Granted literature
- US20100123555A1 SEMICONDUCTOR DEVICE AND INSPECTION METHOD OF SEMICONDUCTOR DEVICE AND WIRELESS CHIP Public/Granted day:2010-05-20
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