Invention Grant
- Patent Title: Method for connecting tab pattern and lead wire
- Patent Title (中): 连接标签图案和导线的方法
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Application No.: US12454967Application Date: 2009-05-27
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Publication No.: US07937822B2Publication Date: 2011-05-10
- Inventor: Eiji Misaizu , Makoto Hiramoto
- Applicant: Eiji Misaizu , Makoto Hiramoto
- Applicant Address: JP Negano
- Assignee: Minebea Co., Ltd.
- Current Assignee: Minebea Co., Ltd.
- Current Assignee Address: JP Negano
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JP2008-151626 20080610
- Main IPC: G01R3/00
- IPC: G01R3/00

Abstract:
A method is for connecting a tab pattern formed on a base sheet and a lead wire, wherein the tab pattern includes: a tab main portion; and a connecting portion formed to continue from one edge line of the tab main portion and to extend from the tab main portion along an extension line that is substantially orthogonal to the edge line, and wherein the method includes: connecting the lead wire on the tab main portion by bonding the lead wire at a position being displaced from the extension line of the connecting portion for more than a given offset amount where the extension line is identical to a center line of the connecting portion, the position being within a given distance from the edge line of the tab main portion.
Public/Granted literature
- US20090300913A1 Method for connecting tab pattern and lead wire Public/Granted day:2009-12-10
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