Invention Grant
- Patent Title: Method for manufacturing nonreciprocal circuit device and method for manufacturing composite electronic component
- Patent Title (中): 制造不可逆电路器件的方法和制造复合电子部件的方法
-
Application No.: US12416209Application Date: 2009-04-01
-
Publication No.: US07937824B2Publication Date: 2011-05-10
- Inventor: Yoshinori Taguchi
- Applicant: Yoshinori Taguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-137980 20080527
- Main IPC: H01P11/00
- IPC: H01P11/00 ; H01Q13/00 ; H01Q17/00 ; H01S4/00 ; H01L23/48 ; H01L21/00
Abstract:
A method for manufacturing a nonreciprocal circuit device in which a ferrite-magnet device including ferrite having first and second center electrodes arranged to intersect and be electrically insulated from each other and a pair of permanent magnets fixed to both principal surfaces of the ferrite so as to apply a direct current magnetic field to the ferrite is solder-bonded to a surface of a substrate. The ferrite-magnet device is solder-bonded to the surface of the substrate while a magnetic plate is disposed on a back surface of the substrate.
Public/Granted literature
Information query
