Invention Grant
- Patent Title: Dual hot melt adhesive systems
- Patent Title (中): 双热熔胶系统
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Application No.: US12228804Application Date: 2008-08-15
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Publication No.: US07937908B2Publication Date: 2011-05-10
- Inventor: David J. Anzini , Rusty Koenigkramer , Glyn Russell , Ernesto L. Pitargue , Arthur A. Bucci
- Applicant: David J. Anzini , Rusty Koenigkramer , Glyn Russell , Ernesto L. Pitargue , Arthur A. Bucci
- Applicant Address: US IL Glenview
- Assignee: Illinois Tool Works Inc.
- Current Assignee: Illinois Tool Works Inc.
- Current Assignee Address: US IL Glenview
- Agency: Day Pitney LLP
- Main IPC: B65B61/18
- IPC: B65B61/18

Abstract:
The present disclosure relates to the use of first and second adhesives for the attachment of zipper flanges to reclosable packages. A first adhesive is typically a reactive, cross-linkable hot melt adhesive while the second adhesive is typically non-cross-linkable hot melt adhesive, typically, but not limited to, either EVA-based or polyamide-based. Alternatively, the second adhesive can be a coextrusion layer including a resin that is typically used as a sealant layer in zipper extrusion, such as metallocene type linear low density polyethylene.
Public/Granted literature
- US20090056278A1 Dual hot melt adhesive systems Public/Granted day:2009-03-05
Information query
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