Invention Grant
- Patent Title: Injection apparatus, semiconductor light emitting apparatus, manufacturing apparatus, and manufacturing method of semiconductor light emitting apparatus
- Patent Title (中): 注射装置，半导体发光装置，制造装置和半导体发光装置的制造方法
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Application No.: US11882598Application Date: 2007-08-02
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Publication No.: US07938636B2Publication Date: 2011-05-10
- Inventor: Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
- Applicant: Toshio Hata , Hideaki Tatsuta , Hiromu Tagashira , Taiji Morimoto
- Applicant Address: JP Osaka-shi
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2006-212611 20060803
- Main IPC: B29C41/36
- IPC: B29C41/36 ; B29C41/52 ; B41F15/44
Abstract:
A fluorescence-containing material injection apparatus of the present invention includes a fluorescence-containing material temperature control section, a fluorescence-containing material stirring section, a fluorescence-containing material remaining amount sensor, and a fluorescence-containing material injection amount adjustment section, by which disproportion in the mixture ratio of contaminates in a fluorescence-containing material M is restrained. This makes it possible to evenly apply a fluorescence-containing material onto a semiconductor light emitting element.
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