Invention Grant
- Patent Title: Connector
- Patent Title (中): 连接器
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Application No.: US12223228Application Date: 2007-01-24
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Publication No.: US07938664B2Publication Date: 2011-05-10
- Inventor: Gary Hsieh , Nick Chin , Joseph Hsia , Steve Lev
- Applicant: Gary Hsieh , Nick Chin , Joseph Hsia , Steve Lev
- Applicant Address: FR Versailles
- Assignee: FCI
- Current Assignee: FCI
- Current Assignee Address: FR Versailles
- Agency: Harrington & Smith
- Priority: TW95103569A 20060127
- International Application: PCT/SG2007/000022 WO 20070124
- International Announcement: WO2007/086810 WO 20070802
- Main IPC: H01R13/627
- IPC: H01R13/627

Abstract:
The present invention relates to a connector. The connector includes: a housing; a plurality of the terminals arranged thereon for electrically contacting with a board; a pair of arms extending from two ends of the housing, respectively; a first projection and a second projection formed on each of the arms; and a metal member arranged along the length direction of each of the arms, having a hold-down portion and a first recess for engaging with the first projection with a first buffer space existing therebetween. The metal member is spaced from the second projection by a second buffer space. When the hold-down portion is soldered to a board, the first projection or the second projection may remedy overwarp of the board or the housing.
Public/Granted literature
- US20100240258A1 Connector Public/Granted day:2010-09-23
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