Invention Grant
- Patent Title: Methods and systems for forming tapered cooling holes
- Patent Title (中): 用于形成锥形冷却孔的方法和系统
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Application No.: US11726410Application Date: 2007-03-22
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Publication No.: US07938951B2Publication Date: 2011-05-10
- Inventor: Ching-Pang Lee , Bin Wei , Chen-Yu Jack Chou
- Applicant: Ching-Pang Lee , Bin Wei , Chen-Yu Jack Chou
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Armstrong Teasdale LLP
- Main IPC: B23H9/14
- IPC: B23H9/14 ; B23H3/04

Abstract:
A method for forming holes in an object is provided. The method includes providing an electrochemical machining (ECM) electrode including a first section having insulation that circumscribes the first section, and a second section having insulation that extends only partially around the second section. The method also includes inserting the electrode into the object, such that in a single pass the electrode forms a hole that includes a first portion having a first cross-sectional area and a second portion having a second cross-sectional area.
Public/Granted literature
- US20080230378A1 Methods and systems for forming tapered cooling holes Public/Granted day:2008-09-25
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