Invention Grant
- Patent Title: Method to provide a layer with uniform etch characteristics
- Patent Title (中): 提供具有均匀蚀刻特性的层的方法
-
Application No.: US10919224Application Date: 2004-08-16
-
Publication No.: US07939131B2Publication Date: 2011-05-10
- Inventor: Frank Y. Xu , Christopher J. Mackay , Pankaj B. Lad , Ian M. McMackin , Van N. Truskett , Wesley D. Martin , Edward B. Fletcher , David C. Wang , Nicholas A. Stacey , Michael P. C. Watts
- Applicant: Frank Y. Xu , Christopher J. Mackay , Pankaj B. Lad , Ian M. McMackin , Van N. Truskett , Wesley D. Martin , Edward B. Fletcher , David C. Wang , Nicholas A. Stacey , Michael P. C. Watts
- Applicant Address: US TX Austin
- Assignee: Molecular Imprints, Inc.
- Current Assignee: Molecular Imprints, Inc.
- Current Assignee Address: US TX Austin
- Agency: Fish & Richardson P.C.
- Agent Heather L. Flanagan
- Main IPC: B05D3/12
- IPC: B05D3/12
Abstract:
The present invention includes a method and a composition to form a layer on a substrate having uniform etch characteristics. To that end, the method includes controlling variations in the characteristics of a solid layer, such etch characteristics over the area of the solid layer as a function of the relative rates of evaporation of the liquid components that comprise the composition from which the solid layer is formed.
Public/Granted literature
- US20060035029A1 Method to provide a layer with uniform etch characteristics Public/Granted day:2006-02-16
Information query
