Invention Grant
- Patent Title: Supply mechanism for the chuck of an integrated circuit dicing device
- Patent Title (中): 集成电路切割装置卡盘的供电机构
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Application No.: US12895342Application Date: 2010-09-30
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Publication No.: US07939374B2Publication Date: 2011-05-10
- Inventor: Hae Choon Yang
- Applicant: Hae Choon Yang
- Applicant Address: SG Singapore
- Assignee: Rokko Systems Pte Ltd.
- Current Assignee: Rokko Systems Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Dickstein Shapiro LLP
- Priority: SG200405166-0 20040823; SG200501802-3 20050322
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
Public/Granted literature
- US20110021003A1 SUPPLY MECHANISM FOR THE CHUCK OF AN INTEGRATED CIRCUIT DICING DEVICE Public/Granted day:2011-01-27
Information query
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