Invention Grant
- Patent Title: Method of semiconductor packaging and/or a semiconductor package
- Patent Title (中): 半导体封装方法和/或半导体封装
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Application No.: US12503604Application Date: 2009-07-15
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Publication No.: US07939381B2Publication Date: 2011-05-10
- Inventor: Soon Hock Tong
- Applicant: Soon Hock Tong
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The method includes forming a leadframe. The leadframe is directly bonded to the semiconductor chip. The leadframe is flexed and/or compressed in a mold cavity. The compressed leadframe and the chip are molded into a package.
Public/Granted literature
- US20090278250A1 Method of Semiconductor Packaging and/or a Semiconductor Package Public/Granted day:2009-11-12
Information query
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