Invention Grant
- Patent Title: Plasma doping method and plasma doping apparatus
- Patent Title (中): 等离子体掺杂法和等离子体掺杂装置
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Application No.: US12158820Application Date: 2007-10-04
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Publication No.: US07939388B2Publication Date: 2011-05-10
- Inventor: Tomohiro Okumura , Hisao Nagai , Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno
- Applicant: Tomohiro Okumura , Hisao Nagai , Yuichiro Sasaki , Katsumi Okashita , Hiroyuki Ito , Bunji Mizuno
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-290332 20061025
- International Application: PCT/JP2007/069472 WO 20071004
- International Announcement: WO2008/050596 WO 20080502
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/42

Abstract:
Before a plasma doping process is performed, there is generated a plasma of a gas containing an element belonging to the same group in the periodic table as the primary element of a silicon substrate 9, e.g., a monosilane gas, in a vacuum chamber 1. Thus, the inner wall of the vacuum chamber 1 is covered with a silicon-containing film. Then, a plasma doping process is performed on the silicon substrate 9.
Public/Granted literature
- US20090233385A1 Plasma Doping Method and Plasma Doping Apparatus Public/Granted day:2009-09-17
Information query
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