Invention Grant
US07939614B2 Silicon-containing curing composition and heat cured product thereof
有权
含硅固化性组合物以及它们的热固化产物
- Patent Title: Silicon-containing curing composition and heat cured product thereof
- Patent Title (中): 含硅固化性组合物以及它们的热固化产物
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Application No.: US10594221Application Date: 2005-05-10
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Publication No.: US07939614B2Publication Date: 2011-05-10
- Inventor: Takashi Sueyoshi , Ken-Ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
- Applicant: Takashi Sueyoshi , Ken-Ichiro Hiwatari , Tadashi Janado , Yoshikazu Shoji , Yoshitaka Sugawara
- Applicant Address: JP Tokyo JP Osaka
- Assignee: Adeka Corporation,Kansai Electric Power Company, Inc.
- Current Assignee: Adeka Corporation,Kansai Electric Power Company, Inc.
- Current Assignee Address: JP Tokyo JP Osaka
- Agency: Young & Thompson
- Priority: JP2004-142607 20040512
- International Application: PCT/JP2005/008490 WO 20050510
- International Announcement: WO2005/108496 WO 20051117
- Main IPC: C08G77/04
- IPC: C08G77/04 ; C08G77/12 ; C08G77/14 ; C08G77/20

Abstract:
A curable composition which comprises at least one of the following (A), (B), and (C) and further contains (D) (provided that when (C) is not contained, both (A) and (B) are in the composition. (A): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′ and one or more Si—O—Si bonds. (B): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has an Si—H group and one or more Si—O—Si bonds. (C): A silicon-containing polymer in which the content of components having a weight-average molecular weight of 1,000 or lower is 20 wt. % or lower and which has a reactive group A′, an Si—H group, and one or more Si—O—Si bonds. (D): A catalyst for curing reaction which is a platinum catalyst. The reactive group A′ is any of Si—R1, Si—O—R2, and Si—R3—OCOC(R4)═CH2, provided that R1 and R2 each is alkenyl, R3 is alkylene and/or arylene, and R4 is hydrogen or methyl.
Public/Granted literature
- US20070197755A1 Silicon-containing curing composition and heat cured product thereof Public/Granted day:2007-08-23
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