Invention Grant
US07939845B2 Nitride semiconductor light-emitting device and production method thereof 有权
氮化物半导体发光器件及其制造方法

  • Patent Title: Nitride semiconductor light-emitting device and production method thereof
  • Patent Title (中): 氮化物半导体发光器件及其制造方法
  • Application No.: US12067227
    Application Date: 2006-09-20
  • Publication No.: US07939845B2
    Publication Date: 2011-05-10
  • Inventor: Hiroshi OsawaTakashi Hodota
  • Applicant: Hiroshi OsawaTakashi Hodota
  • Applicant Address: JP Tokyo
  • Assignee: Showa Denko K.K.
  • Current Assignee: Showa Denko K.K.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2005-272424 20050920; JP2005-272574 20050920
  • International Application: PCT/JP2006/318641 WO 20060920
  • International Announcement: WO2007/034834 WO 20070329
  • Main IPC: H01L33/00
  • IPC: H01L33/00
Nitride semiconductor light-emitting device and production method thereof
Abstract:
Disclosed is a semiconductor device which is improved in output power efficiency since reflection by the substrate is reduced. This semiconductor device is also excellent in strength characteristics of a supporting substrate. Also disclosed is a method for producing such a semiconductor device. Specifically disclosed is a nitride semiconductor device wherein at least an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a metal film layer and a plated metal plate are sequentially stacked in this order on a substrate. This nitride semiconductor device is characterized in that the metal film layer and the plated metal plate are partially formed on the p-type semiconductor layer. Also disclosed is a nitride semiconductor device having a structure wherein at least an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a metal film layer and a plated metal plate are sequentially stacked in this order, the device characterized in that the metal film layer and the plated metal plate are partially formed on the p-type semiconductor layer and a light-transmitting material layer is formed on the p-type semiconductor layer in a region where the metal film layer and the plated metal plate are not formed.
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