Chip packages with covers

Invention Grant

US07939918B2 Chip packages with covers 有权

Title translation: 带盖的芯片封装

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Patent Title: Chip packages with covers
Patent Title (中): 带盖的芯片封装
Application No.: US11588489

Application Date: 2006-10-26
Publication No.: US07939918B2

Publication Date: 2011-05-10
Inventor: Avner Pierre Badehi
Applicant: Avner Pierre Badehi
Applicant Address: IE
Assignee: Tessera Technologies Ireland Limited
Current Assignee: Tessera Technologies Ireland Limited
Current Assignee Address: IE
Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
Priority: IL133453 19991212
Main IPC: H01L21/44
IPC: H01L21/44

Abstract:

This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.

Abstract(Chinese):

本发明公开了一种基于晶体的衬底的装置，其包括在其上形成微结构的晶体衬底; 以及至少一个包装层，其通过粘合剂密封在所述微结构上，并且与所述至少一个封装层在所述结晶基底和所述至少一个包装层之间限定至少一个间隙。还公开了一种制备基于晶体基板的器件的方法。

Public/Granted literature

US20070040257A1 Chip packages with covers Public/Granted day:2007-02-22

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/44	....用H01L21/36至H01L21/428各组不包含的方法或设备在半导体材料上制造电极的