Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12258067Application Date: 2008-10-24
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Publication No.: US07939925B2Publication Date: 2011-05-10
- Inventor: Yuki Koide , Kouichi Meguro
- Applicant: Yuki Koide , Kouichi Meguro
- Applicant Address: US CA Sunnyvale
- Assignee: Spansion LLC
- Current Assignee: Spansion LLC
- Current Assignee Address: US CA Sunnyvale
- Priority: JP2007-277308 20071025
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A semiconductor package having a molding unit that seals bonding wires connected to electrode pads of a semiconductor chip is provided with through electrode units comprising bonding wires embedded therein and penetrating the molding unit. A leading end of the respective through electrode units is exposed from an upper surface of the molding unit and a lower surface of the molding unit.
Public/Granted literature
- US20090267207A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-10-29
Information query
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