Multilayer chip scale package

Invention Grant

US07939940B2 Multilayer chip scale package 有权

Title translation: 多层芯片级封装

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Patent Title: Multilayer chip scale package
Patent Title (中): 多层芯片级封装
Application No.: US11959260

Application Date: 2007-12-18
Publication No.: US07939940B2

Publication Date: 2011-05-10
Inventor: Jari Hiltunen
Applicant: Jari Hiltunen
Applicant Address: US CA Santa Clara
Assignee: OmniVision Technologies, Inc.
Current Assignee: OmniVision Technologies, Inc.
Current Assignee Address: US CA Santa Clara
Agency: Lathrop & Gage LLP
Main IPC: H01L29/72
IPC: H01L29/72

Abstract:

A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP.

Abstract(Chinese):

使用树脂涂覆的铜箔制造多层芯片尺寸封装（CSP）。 CSP封装基座具有第一电路由层。将树脂涂覆的铜箔热压到CSP封装基底上，然后图案化以形成第二电路由层。然后在电路由层之间形成导电通孔。有机焊料防腐剂（OSP）用于CSP焊球的表面光洁度。

Public/Granted literature

US20090152720A1 MULTILAYER CHIP SCALE PACKAGE Public/Granted day:2009-06-18

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/70	...双极器件
H01L29/72	....晶体管型器件，如连续响应于所施加的控制信号的