Invention Grant
- Patent Title: Electrically conductive fluid interconnects for integrated circuit devices
- Patent Title (中): 用于集成电路器件的导电流体互连
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Application No.: US12113024Application Date: 2008-04-30
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Publication No.: US07939945B2Publication Date: 2011-05-10
- Inventor: Ioan Sauciuc , Ward Scott
- Applicant: Ioan Sauciuc , Ward Scott
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Kerry D. Tweet
- Main IPC: H01L29/40
- IPC: H01L29/40

Abstract:
Disclosed are embodiments of an electrically conductive fluid interconnect for coupling an integrated circuit (IC) device to a substrate. The IC device may be coupled to the substrate in a socketless manner or using a socket. The electrically conductive fluid interconnect may include, for example, a metal, an electrically conductive paste, or an electrically conductive polymer material. The fluid may be in a liquid or paste state over at least part of an operating temperature range of the IC device, and in other embodiments the fluid may be in the liquid or paste state at room temperature. Other embodiments are described and claimed.
Public/Granted literature
- US20090273083A1 ELECTRICALLY CONDUCTIVE FLUID INTERCONNECTS FOR INTEGRATED CIRCUIT DEVICES Public/Granted day:2009-11-05
Information query
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