Invention Grant
- Patent Title: Thin-film bulk acoustic resonators having perforated bodies that provide reduced susceptibility to process-induced lateral dimension variations
- Patent Title (中): 具有穿孔体的薄膜体声共振器对工艺引起的横向尺寸变化提供降低的敏感性
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Application No.: US12393566Application Date: 2009-02-26
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Publication No.: US07939990B2Publication Date: 2011-05-10
- Inventor: Ye Wang , Harmeet Bhugra
- Applicant: Ye Wang , Harmeet Bhugra
- Applicant Address: US CA San Jose
- Assignee: Integrated Device Technology, Inc.
- Current Assignee: Integrated Device Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Myers, Bigel, et al.
- Main IPC: H01L41/09
- IPC: H01L41/09

Abstract:
Micro-electromechanical acoustic resonators include a resonator body suspended over a substrate. The resonator body may have a single perforation therein, which may extend substantially or completely therethrough. The resonator body may also be configured to have a center-of-mass within an interior of the perforation and/or a nodal line that overlaps the perforation. A perimeter and depth of the single perforation can be configured to reduce a susceptibility of the acoustic resonator to process-induced variations in resonant frequency relative to an otherwise equivalent resonator that omits the single perforation. In other embodiments, the resonator body may have multiple perforations therein that extend along a nodal line of the resonator.
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