Invention Grant
- Patent Title: Probe apparatus and method for measuring electrical characteristics of chips
- Patent Title (中): 用于测量芯片电气特性的探头装置和方法
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Application No.: US12363110Application Date: 2009-01-30
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Publication No.: US07940065B2Publication Date: 2011-05-10
- Inventor: Kazuya Yano , Hiroshi Shimoyama , Masaru Suzuki
- Applicant: Kazuya Yano , Hiroshi Shimoyama , Masaru Suzuki
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-021434 20080131
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/02

Abstract:
A probe apparatus includes a first stage, a second stage, a third stage and an image pickup. A Z position measuring unit measures a Z direction position of the mounting table and has a Z scale extending in the Z direction and a reading unit for reading the Z scale. A computation unit obtains a calculated contact position between the probes and the electrode pads of the substrate to be inspected based on images picked up by the image pickup with respect to a coordinate position on coordinates of a driving system which includes a Z direction position and X and Y direction positions measured by a measuring unit for measuring X and Y direction positions of the mounting table. A correcting unit corrects the Z direction position of the contact position based on the change amount thereof for a next contact operation.
Public/Granted literature
- US20090195263A1 PROBE APPARATUS, PROBING METHOD AND STORAGE MEDIUM Public/Granted day:2009-08-06
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