Invention Grant
- Patent Title: Singulated bare die testing fixture
- Patent Title (中): 单芯裸芯片测试夹具
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Application No.: US12420585Application Date: 2009-04-08
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Publication No.: US07940070B2Publication Date: 2011-05-10
- Inventor: Cheng-Lien Chiang
- Applicant: Cheng-Lien Chiang
- Applicant Address: TW Taipei County
- Assignee: Nichepac Technology Inc.
- Current Assignee: Nichepac Technology Inc.
- Current Assignee Address: TW Taipei County
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
A flexible redistribution membrane and a piece of silicon rubber is used in a testing fixture for testing a singulated bare die. The silicon rubber is used as a cushion under the flexible redistribution membrane against the downward pressure from the bare die during testing so that the top pads of the flexible redistribution membrane can be electrically tight coupling to bottom pads of the bared die to be tested.
Public/Granted literature
- US20090206857A1 SINGULATED BARE DIE TESTING FIXTURE Public/Granted day:2009-08-20
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