Invention Grant
- Patent Title: Inductance element
- Patent Title (中): 电感元件
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Application No.: US12126526Application Date: 2008-05-23
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Publication No.: US07940153B2Publication Date: 2011-05-10
- Inventor: Tsutomu Watanabe
- Applicant: Tsutomu Watanabe
- Applicant Address: JP
- Assignee: Sumida Corporation
- Current Assignee: Sumida Corporation
- Current Assignee Address: JP
- Agency: Von Simson & Chin LLP
- Agent Stephen M. Chin
- Priority: JP2007-139491 20070525
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/02 ; H01F5/00
Abstract:
An inductance element has a first core portion having a winding frame portion; a coil provided on the winding frame portion; a ring-shaped member having an insertion hole to dispose the first core portion therein; and a terminal member having an bonding arm to be fixed to the ring-shaped member via an adhesive member, and a mounting portion.
Public/Granted literature
- US20080290975A1 Inductance Element Public/Granted day:2008-11-27
Information query
