Invention Grant
US07940249B2 Devices using a metal layer with an array of vias to reduce degradation
有权
使用具有通孔阵列的金属层的器件来降低退化
- Patent Title: Devices using a metal layer with an array of vias to reduce degradation
- Patent Title (中): 使用具有通孔阵列的金属层的器件来降低退化
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Application No.: US11591242Application Date: 2006-10-31
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Publication No.: US07940249B2Publication Date: 2011-05-10
- Inventor: George Perreault
- Applicant: George Perreault
- Applicant Address: US FL Melbourne
- Assignee: Authentec, Inc.
- Current Assignee: Authentec, Inc.
- Current Assignee Address: US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044

Abstract:
A device in accordance with the present invention has a top metal layer that shows increased resistance to degradation such as abrasion, erosion, or both. A device in accordance with the present invention includes a device layer and a top metal layer. The device layer includes contact sensing elements and has a plurality of depressions that extend into the device layer. The first metal layer overlies or is adjacent to the contact sensing elements and extends into the depressions. Preferably, a surface of the metal layer opposed to the device layer is contoured to the depressions. In some embodiments the top metal layer makes electrical connections to the contact sensor, but in other embodiments it does not. Preferably, the device forms a finger swipe sensor, and the contact sensing elements are coupled to finger swipe processing electronics.
Public/Granted literature
- US20070098228A1 Devices using a metal layer with an array of vias to reduce degradation Public/Granted day:2007-05-03
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