Compact sub-assemblies of flexible circuits and drivers are provided. The sub-assemblies can occupy less space in an electronic device than conventional sub-assemblies. In one or more embodiments of the present invention, the flexible circuits can be attached to or wires can be disposed on portions of the substrate that previously were unoccupied in conventional sub-assemblies. In one or more embodiments, the sub-assemblies of the present invention also can have wires disposed underneath the driver or vary the width of the wires. In one or more embodiments, the sub-assemblies of the present invention also can have composite wires that occupy less space than wires of conventional sub-assemblies, while still maintaining similar energy flux.