Invention Grant
- Patent Title: Pre-aligned metrology system and modules
- Patent Title (中): 预先对齐的计量系统和模块
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Application No.: US12169373Application Date: 2008-07-08
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Publication No.: US07940391B2Publication Date: 2011-05-10
- Inventor: Shifang Li
- Applicant: Shifang Li
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: G01B11/00
- IPC: G01B11/00
Abstract:
A Pre-Aligned Metrology System comprising a number of Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules for measuring a target on a wafer. The Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules can reduce the maintenance down time and decrease the cost of ownership (COO).
Public/Granted literature
- US20100007885A1 Pre-Aligned Metrology System and Modules Public/Granted day:2010-01-14
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