Current protection in integrated circuit having multiple pads. Different types of current protection structures may be associated with different pads. A common current discharge or charge path may be used to provide current to or draw current from various of these heterogenic current protection structures. Since a common current discharge or charge path is used, the metallization used to formulate a discharge solution is significant simplified. Additionally, the protection structures may be provided with selectively conductive regions that are approximately radially symmetrical around the circumference of the pad. Accordingly, if the protection structures are slightly off center with respect to the bond pad (due to, for example, mask alignment error), the error in the amount of active region around the circumference of the pad is at least partially averaged out.